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High-Performance Thermally Conductive and Electrically Insulating Ceramic Fillers for Thermal Interface Materials

Oct 21, 2025

As electronic equipment continues to evolve towards miniaturization, high integration, and increased power density, the service life of these devices is receiving growing attention. When the heat generated by electronic components during operation cannot be dissipated promptly, it leads to localized heat accumulation within the components, severely impacting the normal functioning of the electronic equipment. Particularly for high-power electrical devices, lifespan degradation primarily stems from interfacial heat dissipation issues in electronic components. Therefore, Thermal Interface Materials (TIMs) possessing both high thermal conductivity and excellent electrical insulation are crucial for ensuring their efficient operation.

 

electronic heat-sink

 

Polymer materials are commonly used as thermal interface materials in electronic components. However, the thermal conductivity of most polymer materials is below 0.5 W·m⁻¹·K⁻¹, which significantly hampers the heat dissipation efficiency of the devices. A prevalent method to enhance the thermal conductivity of polymer materials involves incorporating fillers with higher intrinsic thermal conductivity into the polymer matrix. Ceramic fillers are currently the most widely used thermally conductive fillers in thermally conductive and electrically insulating polymer composites. Commonly used inorganic thermally conductive fillers mainly include: 

Oxides: Al₂O₃, ZnO, MgO, SiO₂, BeO

Nitrides: AlN, BN, Si₃N₄

Carbides: SiC

Incorporating these inorganic ceramic fillers into a rubber matrix enables the production of thermally conductive and electrically insulating materials with good overall performance. These materials show broad application prospects in fields such as electronic packaging, thermal management, energy storage, cables, and heat sinks.

 

AlN filler SEM

 

About Xiamen Juci Technology Co., Ltd. 

Xiamen Juci Technology Co., Ltd. is dedicated to the R&D, production, and sales of high-performance Aluminum Nitride (AlN) ceramic fillers. We offer a comprehensive range of particle sizes, from 1 to 120 microns, to meet diverse application needs. Our AlN fillers are characterized by excellent thermal conductivity and high sphericity, ensuring superior performance in thermal management solutions. It is your ideal partner for high-performance, insulating thermal interface materials.

 

Contact us:
Xiamen Juci Technology Co., Ltd.

Phone: +86 592 7080230
Email: miki_huang@chinajuci.com

Website: www.jucialnglobal.com

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